Power delivery enhancements
The 3rd Gen AMD Ryzen™ processors boast more cores and bandwidth, demanding more power than typical desktop CPUs. Prime X570-Pro is geared up for the demands of these high-core-count processors, offering a stable power to ensure optimal performance.
1. ProCool connectors : It augments the motherboard's link to the PSU with 8+4 pin connectors that pass 12V power directly to the processors. Based on our ProCool design, these jacks use solid pins that can handle more current than hollow-pin connectors.
2. DrMOS Power stages : The CPU VRM on Prime X570-Pro employs a 12+2 power stage design with DrMOS, combining high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that high core count processors demand.
3. Alloy chokes : The Prime X570 series uses efficient alloy chokes and high-quality thermal pads to help transfer heat from the VRM array to a sink with ample surface area for the processors.
4. Durable capacitors : Durable capacitors are engineered to resist extreme temperatures and provide up to 110% better performance than the industry standard.
5. 6-layer PCB design : Multiple PCB layers shift heat away from critical components, providing more headroom to push your CPUs beyond stock speeds.
2. DrMOS Power stages : The CPU VRM on Prime X570-Pro employs a 12+2 power stage design with DrMOS, combining high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that high core count processors demand.
3. Alloy chokes : The Prime X570 series uses efficient alloy chokes and high-quality thermal pads to help transfer heat from the VRM array to a sink with ample surface area for the processors.
4. Durable capacitors : Durable capacitors are engineered to resist extreme temperatures and provide up to 110% better performance than the industry standard.
5. 6-layer PCB design : Multiple PCB layers shift heat away from critical components, providing more headroom to push your CPUs beyond stock speeds.
Cooler by design
Prime X570-Pro features the most comprehensive cooling controls ever, configurable via Fan Xpert 4 or the UEFI BIOS.
●Multiple temperature sources : Each header can dynamically reference three thermal sensors, and via Fan Xpert 4 you can even map the temperature of supported ASUS graphics cards to optimize cooling for GPU and CPU-intensive tasks.
●Dual pump headers : A dedicated header that supplies over 3A for high-performance PWM or DC water pumps, plus a second dedicated header for AIOs.
●4-pin PWM/DC fan : Each onboard header supports auto-detection of PWM or DC fans.
●Dual pump headers : A dedicated header that supplies over 3A for high-performance PWM or DC water pumps, plus a second dedicated header for AIOs.
●4-pin PWM/DC fan : Each onboard header supports auto-detection of PWM or DC fans.
Active Chipset Heatsink Solution
PCIe 4.0 provides twice the bandwidth for data flowing through the chipset, which creates more heat than the previous generation. The Prime X570-Pro features an actively cooled heatsink to prevent throttling during sustained transfers.
● Custom Delta Superflo Fan: The custom low-noise fan features a high-durability bearing with a 60,000-hour L10* lifespan.
* L10 bearing life is a standard metric that specifies the number of hours that 90% of the bearing are expected to continue successfully operating, as a minimum.
● Air Duct: A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
● Finned heatsink: The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
● Air Duct: A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
● Finned heatsink: The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
M.2 heatsink
M.2 drives sit under passive heatsinks to ward off the throttling that can occur with sustained transfers.
Dual PCIe 4.0 M.2 slots
Dual PCIe 4.0 M.2 Slot supports up to 22110 and provide NVMe SSD RAID support for an incredible performance boost. Create a RAID configuration with up to two PCIe 4.0 storage devices to enjoy the fastest data-transfer speeds on the 3rd Generation AMD Ryzen platform.
USB 3.2 Gen 2 Type-A & Type-C
With backward-compatible USB 3.2 Gen 2 Type-A™ and reversible USB 3.2 Gen 2 Type-C™ ports, you'll experience ultimate connection flexibility and blazing data-transfer speeds of up to 10Gbps.
USB 3.2 Gen 2 front-panel connector
Prime X570-Pro front panel USB 3.2 connector is ready for next-gen PC cases and devices.
Pre-mounted I/O
Form meets function in the pre-mounted I/O shield that we pioneered with the ROG series. Now available on Prime X570-Pro, this feature streamlines the installation process for budding builders and savvy enthusiasts alike.
5-Way Optimization
One click takes care of all that complex tuning. ASUS 5-Way Optimization makes your PC smart. It dynamically optimizes essential aspects of the system, providing overclocking and cooling profiles that are tailored for your rig.
• An automated tuning utility that optimizes overclocking and cooling profiles for your unique system configuration.
• Fans stay whisper-quiet for everyday computing, and deliver optimal airflow when the system is crunching through CPU or GPU-intensive tasks.
• Stress test function helps optimize and overclock for CPU- or memory-centric workloads.
• Fans stay whisper-quiet for everyday computing, and deliver optimal airflow when the system is crunching through CPU or GPU-intensive tasks.
• Stress test function helps optimize and overclock for CPU- or memory-centric workloads.
ASUS OptiMem
ASUS OptiMem memory trace layout unleashes the full performance potential of AMD's Infinity Fabric architecture by enabling higher memory frequencies and lower latencies.
