
Power delivery enhancements
standard.
1. ProCool II Power Connectors : Two ProCool connectors ensure a snug and reliable connection to the EPS 12V power lines.
2. Infineon TDA21472 power stage : 16 Infineon TDA21472 power stages comprise the Encore VRM, each rated to handle 70 amps.
3. MicroFine alloy chokes : Each Power stage is accompanied by a high-permeability alloy-core choke rated to handle 45 amps.
4. 10K Japanese-made black metallic capacitors : Input and output filtering is provided by solid-polymer capacitors rated to last thousands of hours at high operating temperatures.

AI overclocking


AI Overclocking


Storage
1. VROC
2. PCH RAID

USB
1. USB 3.2 Gen 2x2
2. USB 3.2 Gen 2 front-panel connectors

Next-gen connectivity
1. Wi-Fi 6 (AX200)
2. 10 Gbps onboard Ethernet
3. Intel Ethernet

Accurate Voltage Monitoring

Cooler by design
● 4-pin PWM/DC fan : Every onboard header supports auto-detection of PWM or DC fans.
● Heatsink fan : One header is dedicated fully to the onboard heatsink fan.
● Fan extension card II : Bundled card Includes six additional DC or PWM fan headers, plus three thermal-probe headers.
● Water pump+ : A dedicated header can supply over 3 amps to high-performance PWM or DC water pumps.
● Water in/out : A dedicated header enables monitoring of temperatures at the input/output points of any component.
● Water flow : A dedicated header enables constant monitoring of flow rate throughout the entire loop.
● Water-block header : A special connector enables specially designed water blocks to provide flow, temperature and leakage data.

Cooling Heatsinks
2.Aluminum I/O cover : An aluminum I/O cover is connected to the primary heatsink via an embedded heatpipe, increasing mass and surface area.
3. Aluminum heatsink cover : The heatsink cover is crafted from pure aluminum to efficiently cool the two onboard M.2 drives.
4. DIMM.2 heatsinks : The ROG DIMM.2 module now passively cools M.2 drives with metal heatsinks that also keep your build looking clean.
5. Solid steel backplate : A steel, electro-galvanized, cold-rolled coil construction backplate strengthens the motherboard to prevent bending, and adds additional mass to siphon heat from the VRM.
6. PCH heatsink : A PCH heatsink blends seamlessly with the aluminum heatsink cover and prominently features the ROG logo.

OPTIMEM III DDR4 4266+ MHZ (O.C.)

Performance level up

Sonic Studio III
Sonic Studio Link
Sonic Studio Virtual Mixer
